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Full Feature PCB Manufacturing

Multitech Electron HK Limited is a High-end PCB  manufacturer in China with a long standing tradition of quality and excellence. The company produces PCB's with up to 100 layers, an aperture of up to 0.1 mm, max board thickness of up to 8.0 mm, max copper thickness of 20oz and a min line width/line space of 2.0/2.0mil. We have abundant experience in making Heavy Copper PCBs, Mixed PCBs, High Frequency PCBs, High TG, HDI PCBs, anylayer Blind/Burried vias PCB, Semi-flex PCBs, Rigid-flex PCBs.


Multitech PCB Capabilities

RIGID PCB

Feature Capability
Quality Grade Standard IPC 2
Number of Layers 1 - 60 layers
Order Quantity 1pc - 10,000,000 pcs
Build Time 2days - 5weeks (Expedited Service)
Material FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg,Rogers, Arlon Taconic Nelco
Board Size Min 6*6mm | Max 1200*700mm
Board size tolerance ±0.1mm - ±0.2mm
Board Thickness 0.2mm - 8.0mm
Board Thickness Tolerance ±0.1mm - ±10%
Copper Weight 0.5oz - 12.0oz
Inner Layer Copper Weight 0.5oz - 6.0oz
Copper Thickness Tolerance +0μm +20μm
Min Tracing/Spacing 2mil/2mil
Solder Mask Sides As per the file
Solder Mask Color Green, White, Blue, Black, Red, Yellow, Purple, Grey
Silkscreen Sides As per the file
Silkscreen Color White, Blue, Black, Red, Yellow
Surface Finish HASL - Hot Air Solder Leveling
Lead Free HASL - RoHS
ENIG - Electroless Nickle/Immersion Gold - RoHS
ENEPIG - Electroless Nickel Electroless Palladium Immersion Gold - RoHS
Immersion Silver - RoHS
Immersion Tin - RoHS
OSP -Organic Solderability Preservatives - RoHS
Min Annular Ring 3mil
Min Drilling Hole Diameter 6mil, 4mil-laser drill
Min Width of Cutout (NPTH) 0.8mm
NPTH Hole Size Tolerance ±.002" (±0.05mm)
Min Width of Slot Hole (PTH) 0.6mm
PTH Hole Size Tolerance ±.003" (±0.08mm) - ±4mil
Surface/Hole Plating Thickness 20μm - 30μm
SM Tolerance (LPI) .003" (0.075mm)
Aspect Ratio 1:40 (hole size: board thickness)
Test 10V - 250V, flying probe or testing fixture
Impedance tolerance ±5% - ±10%
SMD Pitch 0.2mm(8mil)
BGA Pitch 0.2mm(8mil)
Chamfer of Gold Fingers 20, 30, 45, 60
Other Techniques Gold fingers
Blind and Buried Holes
peelable solder mask
Edge plating
Carbon Mask
Kapton tape
Countersink/counterbore hole
Half-cut/Castellated hole
Press fit hole
Via tented/covered with resin
Via plugged/filled with resin
Via in pad
Electrical Test



FLEX PCB

Feature Capability
Quality Grade Standard IPC 2
Number of Layers 1 - 16 layers
Build Time 2days - 5weeks
Material DuPont PI, Domestic Shengyi PI
Board Size 490*1800mm,240*4000mm
Board Thickness 0.04-2.5mm
Copper Weight (Finished) 1/3oz-2oz,6oz
Min Tracing/Spacing 0.035/0.035mm
Solder Mask Sides As per the file
Solder Mask Color Green, White, Blue, Black, Red, Yellow
Solder-stop coating---Soldermask oil Green, White, Blue, Black, Red, Yellow
Solder-stop coating---Coverlay PI and PET film
Silkscreen Sides As per the file
Silkscreen Color White, Black, Yellow
Surface Finish HASL - Hot air solder leveling
Lead - free HASL - RoHS
ENIG - RoHS
Immersion Tin - RoHS
OSP - RoHS
Min Annular Ring
Min Drilling Hole Diameter
Min. hole size---Drilling (PTH) 0.2mil
Min. hole size---Punching (NPTH) 0.05/±0.02mm
Tolerance of dimension ±0.03mm
Other Techniques Peelable solder mask
Gold fingers
Stiffener (only for PI/FR4 substrate)



FLEX, RIGID-FLEX, and HDI SUBSTRATES

Product Standard Flex Circuits Standard Rigid-flex Circuits High Density Interconnect (HDI) Flex Circuits
Standard Panel Size 490*1800mm,240*4000mm 100mm x 100mm 250mm x 400mm
Line Width and Spacing .001" (0.035mm) .003" (0.07mm) .003" (0.07mm)
Copper Thickness 1/3 oz - 2 oz, 6 oz 1/4 to 1/2 oz. 1/2 oz. and higher
Layer Count 1-16L Up to 36L Up to 18
Surface Finish HASL - Hot air solder leveling
Lead - free HASL - RoHS
ENIG - RoHS
Immersion Tin - RoHS
OSP - RoHS
HASL - Hot air solder leveling
Lead - free HASL - RoHS
ENIG - RoHS
Immersion Tin - RoHS
OSP - RoHS
HASL - Hot air solder leveling
Lead - free HASL - RoHS
ENIG - RoHS
Immersion Tin - RoHS
OSP - RoHS
Via/ Drill Size
Minimum Drill (Mechanical) Hole Diameter .008" (0.2 mm) .006" (0.15 mm) .008" (0.2 mm)
Minimum Via (Laser) Size 5 mil (0.15 mm) 1 mil (0.025 mm) 6 mil (0.15 mm)
Minimum Micro Via (Laser) Size 2 mil (0.05 mm) 1 mil (0.025 mm) 3 mil (0.07 mm)
Stiffener Material Polyimide / FR4 / Metal Polyimide / FR4 / Metal Polyimide / FR4
Shielding Material Copper / Silver Ink / Tatsuta / Carbon Copper / Silver Ink / Tatsuta / Carbon Copper / Silver Ink / Tatsuta / Carbon
Tooling Tolerance 2 mil (0.05 mm) 1 mil (0.025 mm) 2 mil (0.05 mm)
Zif Tolerance 2 mil (0.05 mm) 1 mil (0.025 mm) 2 mil (0.05 mm)
Solder Mask
Solder Mask Bridge Between Dam 5 mil (0.13 mm) 4 mil (0.11 mm) 5 mil (0.13 mm)
Solder Mask Registration Tolerance 4 mil (0.11 mm) 4 mil (0.11 mm) 5 mil (0.13 mm)
 
Coverlay
Coverlay Registration 8 mil (0.20 mm) 5 mil (0.13 mm) 8 mil (0.20 mm)
PIC Registration 7 mil (0.18 mm) 4 mil (0.11 mm) 7 mil (0.18 mm)
Solder Mask Registration 5 mil (0.13 mm) 4 mil (0.11 mm) 5 mil (0.13 mm)
Stiffener
PI Stiffener      
Stiffener Registration 10 mil (0.25 mm) 10 mil (0.25 mm) 10 mil (0.25 mm)
Thickness Tolerance 10% 10% 10%
FR4 Stiffener      
Stiffener Registration 10 mil (0.25 mm) 10 mil (0.25 mm) Layer to Layer
Thickness Registration 10% 10% 5 mil (0.13 mm)
 
Legend
Minimum Height 35 mil (0.89 mm) 25 mil (0.64 mm) 35 mil (0.89 mm)
Minimum Width 8 mil (0.20 mm) 6 mil (0.15 mm) 8 mil (0.20 mm)
Minimum Space 8 mil (0.20 mm) 6 mil (0.15 mm) 8 mil (0.20 mm)
Registration +/- 5 mil (0.13 mm) +/- 5 mil (0.13 mm) +/- 5 mil (0.13 mm)
Impedance +/- 10% +/- 10% +/- 10%
SRD (Steel Rule Die)
Outline Tolerance 5 mil (0.13 mm) 2 mil (0.051 mm) 5 mil (0.13 mm)
Minimum Radius 5 mil (0.13 mm) 4 mil (0.11 mm) 5 mil (0.13 mm)
Inside Radius 20 mil (0.51 mm) 10 mil (0.25 mm) 31 mil (0.79 mm)
Punch Minimum Hole Size 40 mil (1.02 mm) 31.5 mil (0.80 mm) N/A
Tolerance of Punch Hole Size +/- 2 mil (0.051 mm) +/- 1 mil (0.025 mm) N/A
Slot Width 20 mil (0.51 mm) 15 mil (0.38 mm) 31 mil (0.79 mm)
Tolerance of Hole to Outline +/- 3 mil (0.07 mm) +/- 2 mil (0.051 mm) +/- 4 mil (0.11 mm)
Tolerance of Hole Edge to Outline +/- 4 mil (0.11 mm) +/- 3 mil (0.07 mm) +/- 5 mil (0.13 mm)
Minimum of Trace to Outline 8 mil (0.20 mm) 5 mil (0.13 mm) 10 mil (0.25 mm)

Upload PCB files( gerber file, .pcb, .pcbdoc or .cam file format)

Thanks for reviewing our PCB capabilities. Please upload your PCB files in the format of gerber file, .pcb, .pcbdoc or .cam file when you go through our online purchase procedures. You can also send your Gerber via email (sales@multitech-pcb.com), but we strongly suggest you order online on the webpages.


Making a PCB - PCB Manufacture step by step


Our Customers

Military Military and aerospace: We have large customer base in these industries. Customers choose us to make their PCBs in the prototype and production stage.

MedicineMedicine: Medicine and biomedical clients occupy a large part of our customers. We have strict quality standard and short lead time and our price is competitive, our customer base in this area is still on the rise.

CommercialCommercial, industrial and automotive: Most of our customers are in these industries. Fast response, short delivery time, professional engineering support continuously affordable price help retain and expand customer scale in these industries.

schoolUniversity, school and amateur: Students are our future scientists, we support them! Students and amateurs are price sensitive customers, our price guarantees they will rely on us for their PCB needs in terms of price and quality! At the same time, our educational sponsorship program provides free PCBs to university students, please send us the details of your project or competition at sales@multitech-pcb.com.