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PCB circuit board manufacturing packaging process
1, the process goal

"Packaging" is a process that is highly valued in the PCB factory. It usually falls short of the steps in the manufacturing process. The main reason is that, on the one hand, it does not generate added value. On the other hand, Taiwan's manufacturing industry has not focused on products for a long time. The unpredictable benefits that packaging can bring are the best in Japan. Observing Japan’s home electronics, daily necessities, and even foods in the same way, people would rather spend more money on Japanese goods. This has nothing to do with admiring Mei Yang, but it is the mastery of consumers’ mentality. Therefore, in particular, the packaging will be discussed independently, so that the PCB industry will know that small improvements may have great results. Another example is that Flexible PCBs are usually small ones, and the number is very large. Japan's packaging method may be used to form a special packaging container for the shape of a certain product, which is convenient and useful for protection.

2, early packaging

For the early packaging methods, see the outdated shipping methods. At present, there are still some small plants that are packaged according to these methods.

The domestic PCB production capacity is expanding at a high speed, and most of them are exported. Therefore, the competition is very fierce. Not only is there competition among domestic factories, but also the competition between the top two US and Japan PCB manufacturers, in addition to the technical level and quality of the product itself. With the recognition of customers, the quality of packaging must be satisfied with the satisfaction of customers. Almost a small-scale electronics factory will now require PCB manufacturers to ship the packaging, must pay attention to the following matters, some even directly to the shipping packaging specifications.

1. Must be vacuum packed

2. The number of plates per stack is limited by the size is too small

3. Specifications for the tightness of each PE film and the width of the edge

4. Specification of PE film and Air Bubble Sheet

5. Carton pounds and other specifications

6. Are there any special provisions for buffering before the board is placed on the inside of the carton?

7. After the sealing resistance specifications

8. Each box weight limit

At present, the vacuum packaging in China is very similar, and the main difference is only the effective working area and the degree of automation.

3, Vacuum Skin Packaging (Vacuum Skin Packaging)

Operating procedure

A. Preparation: Position the PE film, manually operate each mechanical action, set the PE film heating temperature, and vacuum time.

B. Stacking board: When the stacking board number is fixed, its height is also fixed. At this time, it is necessary to consider how to stack, which can maximize the output and save the material. The following are several principles:

a. The spacing between each board, depending on the PE film specifications (thickness), (the standard is 0.2m/m), using its heating and softening and elongating principle, while vacuuming, covering the back of the board and the air bubble paste . The spacing is generally at least twice the thickness of the total plate. Too big is a waste of material; too small is difficult to cut and extremely easy to peel off the adhesive or not stick at all.

b. The distance between the outermost plate and the edge must also be at least twice the plate thickness distance.

c. If PANEL is not large in size, according to the above packaging method, material and manpower will be wasted. If the quantity is extremely large, it may be similar to the soft board packaging method to open the container and then PE film shrink packaging. There is another way, but it is necessary to solicit the consent of the customer to leave no gaps between each board, but separate them with cardboard and take the appropriate number of stacks. Hard paper or corrugated paper is also underneath.

C. Start: A. Press the start, warm the PE film, led by the pressure frame and cover the table top B. Then suck the air from the bottom vacuum pump and stick to the circuit board, and stick it with the bubble cloth. C. After the heater is removed and allowed to cool, raise the frame. D. After cutting off the PE film, pull the chassis apart and cut it apart.

D. Packing: The packing method, if specified by the customer, must be in accordance with the customer's packing specification; if the customer does not specify, the packing specification in the factory must also be established in the principle of protecting the board from being damaged by external forces. As mentioned earlier, especially the packaging of exported products requires special attention.

E. Other notes:

a. The information that must be written outside the box, such as "Korean head", item number (P/N), version, cycle, quantity, and important information. And Made in Taiwan (if export) words.

b. Attach relevant quality certificates such as slicing, solderability report, test records, and some test reports required by various customers, and place them in the manner specified by the customer. Packaging is not a door to the university. Do it with all your heart's content, and you can save a lot of trouble that should not have occurred.