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How to deal with glitches on the surface of the board prototype board


There are generally several methods: the quality of the pre-plated layer should be taken care of for complex shaped parts, to prevent replacement of the copper layer; regular addition of hydrogen peroxide, appropriate fierce mixing should be added; test and ensure the concentration of sulfuric acid, thereby reducing the role of copper powder; Phosphorus content is not acceptable anode can not be used; anode and cathode area ratio shall not be less than l.5:1; anode sleeve should not be too thick to prevent clogging (single layer polyester cloth is appropriate); anode hook and pole bar contact should be good.

There are many places to pay attention to. If you need proofing of the circuit board or any problems with your board, please visit the official website: http://multitech-pcb.com/.