Punching - Chemical Immersion Copper - Full Plate Thick Copper Plating - Pattern Transfer - Copper Plating - Alkaline Etching - Production Process
The purpose of full-plate thicker electroplated copper is to increase the strength of the electroless copper plating layer.
Due to the uneven current density distribution during the electroplating of copper, unevenness of the copper surface thickness of the entire plate may be caused.
In the part with high current density, the thickness of copper is large;
In the part with low current density, the thickness of copper is small.
In this way, during the alkaline time, if complete etching is performed, over-etching occurs in a portion with a small copper thickness.
Primary copper plating production PCB process
Punching - Chemical Immersion Copper - Pattern Transfer - Circuit Plating Copper - Alkaline Etching
This process eliminates the previously mentioned partial over-etching phenomenon due to the absence of a full plate thicker electroplating copper process.
At the same time, since the thickness of the etched copper layer is less than that of the secondary copper plating process, over-etching of the entire board can be better controlled.