RESONAC's range of materials MCL-E-795G applications
PROTEL's DXP Manually Modifying Adapter Cables Too Many Cables PROTEL's DXP cabling is the reason why algorithms often corner too much, often making the point of view difficult to troubleshoot. This can be greatly improved by manual adjustments. This adjustment will involve the interconnection of wires and even the location you want to make the entire layout. Automatically routed in the council, it's easy to find too many lines in a corner. Cabling corner is too much trouble. In particular, there are many corners of wires and wires and wires of NetU6_15 Network - 12 and the restraint network is analyzed in detail to determine the wiring adjustments so there will be a better way to wire. The following detailed line adjustment program. We - 12 network cable automatic routing carefully observed in the filter toolbar, select the filter network conditions, in the drop-down menu, select - 12 network, you can use - 12 network filter out. -12 Internet experience from the bottom of a network from the bottom of the well. Its basic straight line, the automatic adjustment is very good, but in a short period of wire a top level bending fold happy, and the corner is too much. And, since this is not a reasonable route, it also causes too much corner of the network NetU6_15 to leave the unnecessary path. So we set it to the location of 12 through the hole in the cost of the top line of the network to GND from the top of the J2 'chapter pad connected immediately to the 11-12 solder joint. The following steps, first through the hole location, as shown in Figure 3. Select the TopLayer layer, and then set the hole to the right of the line to the hole, from now on until the 11 component - 12 pad redrawn the cable as shown in Figure 4. The NetU6_15 line is the wrong way to route wires directly, but there are many turns for automatic on-line cloth. Similarly, we also filter out the network NetU6_15 line. Similarly, in the Toplayer layer, we will point to delete, wiring, adjusted as shown in Figure 6. Adjusting the wiring is a good improvement, change and after that, as shown in Figure 7 of the network cabling. Can be seen, wire, conductor layout adjustment, cheaper and beautiful.
RESONAC's material MCL-E-795G are mainly used in semiconductor packaging substrates used in large servers and high-performance computing (HPC) in data centers. This material has low warpage and high heat resistance, which can meet the requirements of high package reliability for these devices.
In addition, the MCL-E-795G also has a low coefficient of thermal expansion (CTE), especially in the X and Y directions, this makes it significantly effective in reducing package warpage. This characteristic makes it very suitable for use in the central core part of a multilayer structure, such as a TEG chip in a 3-2-3 structure.
From a technical point of view, MCL-E-795G combine high elastic modulus and low CTE characteristics to reduce warpage by 15 to 20% compared to traditional products. Its main structure uses a resin that resists heat shock and external stress, which further improves its heat resistance.
In summary, MCL-E-795G is widely used in the field of semiconductor packaging substrates for high-performance computing and big data centers that require high packaging reliability, and due to its excellent low thermal expansion rate and high elastic rate, particularly suitable for core components of multilayer structures.
What is the specific coefficient of thermal expansion (CTE) of MCL-E-795G material?
In the search results provided, specific coefficient of thermal expansion (CTE) values for MCL-E-795G materials are not directly given.All mentioned MCL-E-795G materials, and all mentioned low CTE as one of their characteristics, but no specific value was given.