High-Density Interconnect (HDI) Circuit Boards, also known as HDI PCBs, have a higher wiring density per unit area compared to traditional printed circuit boards. HDI PCBs are characterized by one or more of the following features: microvias (blind vias and buried vias), laminate structures, and considerations for high signal performance.

The technology behind PCBs has evolved with new developments that require smaller, more efficient products. As a result, HDI boards are more compact, with fewer through-holes, pads, copper tracks, and spaces compared to traditional boards.

HDI boards have a denser routing, leading to lighter, more compact PCBs with fewer layers. In some cases, HDI boards may be capable of performing the functions of multiple PCBs without the need to create multiple boards.

Key Advantages of HDI Circuit Boards:

Reduced PCB Costs If the density of the PCB exceeds 8 layers, HDI manufacturing is employed. Additionally, this process is cheaper than traditional complex lamination techniques.

Increased Circuit Density Traditional boards and components require routing around QFPs (Quad Flat Packages) and other components, whereas HDI boards can integrate these components more efficiently due to their higher density and advanced via technology.