Ceramic PCBs are made from thermally conductive ceramic powders combined with organic binders that facilitate heat transfer. The thermal conductivity of ceramic PCBs ranges from 9 to 20 W/m. Ceramic PCBs are a type of printed circuit board where the substrate is made from highly thermally conductive ceramics such as aluminum oxide (Al₂O₃), aluminum nitride (AlN), beryllium oxide (BeO), silicon carbide (SiC), and boron nitride (BN). These materials can quickly transfer heat away from hot spots and disperse it over the entire surface area.

Moreover, ceramic PCBs can be fabricated using Laser Activated Metallization (LAM) technology, which gives them high adaptability. They can serve as substitutes for conventional PCBs but offer a simpler structure and superior performance. Ceramic PCBs find extensive application in high-voltage, high-insulation, and high-frequency temperature electronics due to their reliability and compact size. They are commonly used in cooling devices, high-power circuits, high-power LEDs, sensors, RF modules, Battery Management Systems (BMS), power supplies, solar cell systems, semiconductor coolers, large machinery control modules, medical centers, and automotive electronics.

The use of ceramic substrates in PCBs allows for better thermal management, increased durability under extreme conditions, and enhanced electrical performance, making them ideal for specialized applications where standard PCBs might not suffice.